ic substrates serve as the core component in advanced chip packaging, fulfilling three critical functions: chip protection, electrical interconnection, and thermal management. they surpass conventional pcb capabilities to enable ultra-high-density connectivity between chips and mainboards. utilizing specialized materials like abf/bt, they support ultra-fine circuits (line/space to 8μm) and incorporate micro-bumps and redistribution layers for precise i/o connections with sub-micron accuracy. this technology meets rigorous signal and power integrity requirements while enabling advanced architectures like 2.5d/3d integration and chiplets, making it essential for ai, high-performance computing, and premium communication chips.
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| layers | 2 -8l |
| strip size | 189.0*68.0，70.0*240.0，75.0*240.0， 76.3*240.0， 95.0*240.5etc. |
| unit size | 5.4*6.8，8.1*8.1 / 15*16/ 19*19 etc. |
| material | mgc 832nxa / 832ns / 972 series hitachi 705g/ 770g series aus308 / aus 320 / sr1 |
| finished thickness | 0.120~0.500 mm |
| min. trace width/space | 0.025mm / 0.025 mm |
| product feature | impedance,selected osp, sm coining |
| applications | wearables，wireless etc. |
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| layers | 2-4l |
| strip size | 75.0*240.0，76.3*240.0etc. |
| unit size | 1.5*4.0 etc |
| material | doosan 7409hgb(le)/(gq) series aus308 |
| finished thickness | 0.500~0.800 mm |
| min. trace width/space | 0.040mm / 0.040 mm |
| product feature | sm coining |
| applications | phone,wearables,pcetc. |
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| layers | 2 ~4 l |
| strip size | 66.0*142.0，50.8*188.95，50.8*152.4， 74.0*240.0，75.0*240.0，76.3*240.0etc. |
| unit size | 2*2/ 3*3 etc. |
| material | mgc 832nxa / 832ns series syl si13u / si10us series aus308 |
| finished thickness | 0.120~0.500 mm |
| min. trace width/space | 0.040mm / 0.040 mm |
| product feature | sm coining |
| applications | phone,wearables,pc,automobileetc. |
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| layers | 2 ~4 l |
| strip size | 50.8*188.95，187.5*50.0etc. |
| unit size | 1.5*4.2 etc. |
| material | mgc 832nxa / 832ns series nanya npg-180bk / inbk series ausmeh / eg23 |
| finished thickness | 0.200~0.500 mm |
| min. trace width/space | 0.040mm / 0.040 mm |
| product feature | sm coining |
| applications | phoneetc. |
craft show
| layers | 2~4 l |
| strip size | 93.81*93.81，189.0*68.0，75.0*240.0， 100.0*103.0，76.3*240.0etc. |
| unit size | 1814 / 1612 / 1411 / 1109 etc. |
| material | mgc 832ns series hitachi 705gseries aus308 / aus 320 |
| finished thickness | 0.120~0.300 mm |
| min. trace width/space | 0.025mm / 0.025 mm |
| product feature | coreless structure,ets structure |
| applications | phone,wearablesetc. |
jiangsu ic substrate plant
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