mobile phone module
craft show
| layers | 3l |
| board thickness | 0.17±0.03mm |
| material | e1210d250nm |
| line width / space | 0.05±0.015/0.032mm |
| minimum aperture | 0.075mm |
| surface treatment | enig |
fpc use polyimide substrates for 3d dynamic wiring, featuring ultra-thin profiles (<0.2mm), >10,000 bend cycles, and 50μm-level dense routing. with high vibration/temperature resistance, they enable space-saving solutions for foldable phones, aerospace wiring, and medical endoscopes. sdg, as an industry leader, specializes in high-precision fpcs and rigid-flex boards, supplying core components to global brands in consumer electronics, automotive, and medical sectors.
craft show
| layers | 3l |
| board thickness | 0.17±0.03mm |
| material | e1210d250nm |
| line width / space | 0.05±0.015/0.032mm |
| minimum aperture | 0.075mm |
| surface treatment | enig |
craft show
| layers | 2l |
| board thickness | ≤0.15mm |
| material | mb12-25-12ueg |
| line width / space | 0.05±0.020/0.033mm |
| minimum aperture | 0.05mm |
| surface treatment | enig |
craft show
| layers | 2l |
| board thickness | 0.12mm |
| material | mb12-25-12ceg |
| line width / space | 0.06/0.06mm |
| minimum aperture | 0.1mm |
| surface treatment | gilt |
shenzhen fpc plant
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